Semiconductors

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8 ARTICLES

4w ago

Hot Chips Shows Memory Wall Deepening as HBM Packaging Hits Physical Limits

Vendors say compute is outpacing HBM bandwidth and that thermal and thickness constraints are forcing near‑term fixes while advanced copper bonding is postponed to a later HBM generation.

3 ARTICLES

4w ago

Kyoto University Demonstrates SiC Transistor That Runs at 600°C

4 ARTICLES

last mo.

Applied Materials Posts Record Quarter as Stock Is Repriced

7 ARTICLES

last mo.

Applied Materials Raises Q4 Guide on Strength in DRAM and Packaging, Shares Fall

3 ARTICLES

last mo.

TSMC and Taiwan Researchers Build MoS2 Transistor With 0.42 nm Engineered Interface

3 ARTICLES

last mo.

Commerce Signs Letters of Intent for $874 Million in CHIPS Incentives and Seeks Minority Equity Stakes

4 ARTICLES

2mo ago

Navitas Reports Q2 Revenue Gain as It Pushes Into AI Power Chips

3 ARTICLES

2mo ago

Synopsys Unveils Fully Autonomous Agentic EDA and CAE Workflows Built With NVIDIA

12 ARTICLES

2mo ago

ASML Hikes 2026 Guidance Again After Q2 Beat and Plans Big 2027 Capacity Build

15 ARTICLES

2mo ago

ASML Raises 2026 Revenue Forecast as AI Demand Forces Big Capacity Push

8 ARTICLES

2mo ago

Tower Semiconductor Announces $3 Billion Japan Expansion Backed by $1 Billion in METI Grants

4 ARTICLES

2mo ago

Wall Street Reprices AMD on Rising AI Server Demand

3 ARTICLES

2mo ago

Applied Materials Rallies After CEO Says Customers Are Laying Out Demand to 2030

6 ARTICLES

2mo ago

TSMC Reportedly Plans 5–10% Price Hikes on Advanced Nodes

3 ARTICLES

2mo ago

IBM Unveils NanoStack, a Claimed 0.7 nm Three‑Dimensional Transistor Design

Semiconductors

Hot Chips Shows Memory Wall Deepening as HBM Packaging Hits Physical Limits

Kyoto University Demonstrates SiC Transistor That Runs at 600°C

Applied Materials Posts Record Quarter as Stock Is Repriced

Applied Materials Raises Q4 Guide on Strength in DRAM and Packaging, Shares Fall

TSMC and Taiwan Researchers Build MoS2 Transistor With 0.42 nm Engineered Interface

KAIST Unveils Programmable Memtransistor That Adapts Its Response Speed

AMD Posts Record Data‑Center Quarter, Investors Flag CapEx and Cash‑Flow Risks

Entegris Posts Strong Quarter as AI-Driven Chip Demand Boosts Sales

GlobalFoundries Directors Withheld Shares at Below-$50 Prices

Applied Materials Jumps After Peer Beat but Remains Well Below Prior Highs

Never miss stories about

Semiconductors

Commerce Signs Letters of Intent for $874 Million in CHIPS Incentives and Seeks Minority Equity Stakes

Navitas Reports Q2 Revenue Gain as It Pushes Into AI Power Chips

Synopsys Unveils Fully Autonomous Agentic EDA and CAE Workflows Built With NVIDIA

ASML Hikes 2026 Guidance Again After Q2 Beat and Plans Big 2027 Capacity Build

ASML Raises 2026 Revenue Forecast as AI Demand Forces Big Capacity Push

Tower Semiconductor Announces $3 Billion Japan Expansion Backed by $1 Billion in METI Grants

Wall Street Reprices AMD on Rising AI Server Demand

Applied Materials Rallies After CEO Says Customers Are Laying Out Demand to 2030

TSMC Reportedly Plans 5–10% Price Hikes on Advanced Nodes

IBM Unveils NanoStack, a Claimed 0.7 nm Three‑Dimensional Transistor Design

Never miss stories about

Semiconductors