Technology ❯ Semiconductors

Memory Technology

DRAM High-Bandwidth Memory High Bandwidth Memory DRAM and NAND HBM Market Trends NAND Flash Memory High Bandwidth Memory (HBM) LPDDR Memory AI Memory Solutions

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

The packaging change creates a direct thermal path inside stacked memory to cut hotspots and reduce performance throttling in dense AI systems.

Stories older than 24h

Micron’s AI-Driven Rally Strengthens as Virginia Plant Begins Advanced DRAM Production

Morgan Stanley Estimates Nvidia Vera Rubin Rack BoM at $7.8M

Kerrisdale Shorts Everspin as Shares Drop Up to 11 Percent

Reports Point to Samsung HBM Packaging for Exynos to Boost On-Device AI

Micron’s AI Memory Surge Pushes Market Value Near $900 Billion

Leveraged DRAM Product Filed as Memory ETF Becomes Fastest to $6.5 Billion

SK Hynix Nears $1 Trillion as AI Memory Boom Lifts Korea’s Market

AI Memory Crunch Deepens as Prices Soar and Shortage Timeline Extends to 2028

Samsung Weighs BOE Panels for Base Galaxy S27 to Cut Costs

AI Boom Powers Breakneck Rally Across Chip Stocks as SOX Jumps 50%

Everspin Hits 52-Week High After Microchip Deal to Boost U.S. MRAM Output

Micron Jumps to a 52-Week High as Cloud Giants Warn of Soaring Memory Costs

Samsung Chip Union Sets 18-Day Strike, Threatening Memory Supply

South Korea Jails Ex-Samsung Researcher for 7 Years Over DRAM Leak to China’s CXMT

SK hynix Sets Profit Record, Accelerates HBM Packaging With New U.S. and Korea Projects

Lam Research Beats Q3 and Raises Outlook as Analysts Lift Targets

Micron Scales HBM4 Production for AI as Demand Outlook Strengthens

Micron’s Rally Extends on Record Outlook as HBM Capacity Is Booked Into 2027

Micron Draws New Target Hikes on AI Memory Boom as Shares Ease After Big Run