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High-Bandwidth Memory

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SK Hynix Launches iHBM to Embed Cooling Elements Inside HBM Packages

Silicon cooling inserts cut thermal resistance by about 30% to ease scaling of next‑generation AI memory.

Micron's Blowout Quarter Redraws Memory Market

Morgan Stanley Estimates Nvidia Vera Rubin Rack BoM at $7.8M

Reports Point to Samsung HBM Packaging for Exynos to Boost On-Device AI

Leveraged DRAM Product Filed as Memory ETF Becomes Fastest to $6.5 Billion

South Korea Jails Ex-Samsung Researcher for 7 Years Over DRAM Leak to China’s CXMT

Micron’s Rally Extends on Record Outlook as HBM Capacity Is Booked Into 2027

Framework Warns AI Boom Imperils Personal Computing Ahead of April 21 'Next Gen' Launch

SK Hynix Files Record $8 Billion Order for ASML EUV Tools for 2027 Delivery

Samsung Commits 110 Trillion Won for 2026 to Speed Its Push in AI Chips

Applied Materials Raises Outlook on AI-Fueled Demand; Shares Jump

SK hynix Showcases 16-Layer HBM4 and AI Memory Portfolio at CES 2026

Samsung Touts HBM4 Customer Praise as SK hynix Calls AI Demand Permanent

Samsung’s HBM4 Leads Nvidia’s Late-Stage Tests for Rubin as Contract Decisions Near

Micron Reportedly Plans ¥1.5 Trillion HBM Fab in Hiroshima Backed by Japanese Subsidies

Samsung Reportedly Clears Nvidia’s HBM3E Qualification, Turbocharging Shares and the Memory Outlook

Samsung Passes Nvidia's HBM3E Quality Test, Joining the Supply Chain

Micron Poised for Q3 Earnings Release After 95% Stock Surge

Micron Pledges $200 Billion to Expand U.S. Memory Manufacturing With Trump Administration Backing

Micron Invests $7 Billion in Singapore for Advanced AI Chip Facility