Overview
- Intel announced the reorganization on Thursday, June 18, appointing Seok‑Hee Lee as executive vice president of Intel Foundry to run advanced packaging, system integration, back‑end technology development and back‑end manufacturing.
- The company said the change formally establishes advanced packaging as a focused business with dedicated leadership to ramp EMIB‑T and HBI toward high‑volume production for customers and partners.
- Naga Chandrasekaran will concentrate on front‑end process development and manufacturing, accelerating the ramp of Intel 18A, Intel 14A and future node technologies under the split structure.
- Intel disclosed that long‑time executive Navid Shahriari will retire after a 37‑year career, and the leadership news coincided with a roughly 10.6% jump in Intel’s share price after markets reacted positively.
- Lee joins from SK On and previously led SK hynix and earlier held engineering roles at Intel, a background the company says gives him operational and ecosystem knowledge that supports Intel’s foundry turnaround and customer push including reported work with major partners.