Technology ❯ Computing ❯ Hardware ❯ Memory

High-Bandwidth Memory

SK Hynix Launches iHBM to Embed Cooling Elements Inside HBM Packages

Silicon cooling inserts cut thermal resistance by about 30% to ease scaling of next‑generation AI memory.

Micron's Blowout Quarter Redraws Memory Market

Samsung Named Preferred HBM4 Supplier for AMD’s Next AI GPU as Foundry Talks Open

Samsung and SK Hynix Said to Clinch HBM4 for Nvidia’s Vera Rubin as Analysts Lift Micron Targets

Samsung Starts Mass Production and Shipments of HBM4 Memory

Samsung Set to Start HBM4 Production Next Month to Supply Nvidia’s Rubin

SK Hynix Completes HBM4 Development, Readies First Mass-Production System

Samsung's HBM3E Chips Approved for NVIDIA AI Processors