Overview
- SK hynix said Thursday that it has started sending 12‑layer HBM4E samples to major customers, marking a move from product roadmaps into the customer‑qualification phase.
- The sampled modules pack 48 GB per stack, support up to 16 Gbps per pin, and deliver more than 20% better power efficiency than the prior generation.
- SK hynix uses Advanced MR‑MUF packaging to hit the 12‑layer, 48 GB stack and to cut thermal resistance by about 17%, a key step because denser stacks generate more heat.
- Samsung shipped its own 12‑layer HBM4E samples on May 29, so both suppliers are now in partner validation but neither has announced cleared customer qualification or a mass‑production start date.
- The announcement pushed SK hynix shares higher and underlines the commercial stakes for 2027 accelerator supply, with analysts citing SK hynix’s roughly 57–58% HBM market share and customers such as Nvidia in play.