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ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

A dual‑pulse, high‑rate tin‑droplet method now puts pressure on suppliers of optics, debris control, resists, pellicles.

U.S.–Taiwan Tariff Deal Nears as TSMC Secures Arizona Land for Potential Expansion

TSMC Pushes Into 2nm as AI Demand Lifts Results and Spending Targets

Amkor Breaks Ground on $7 Billion Chip Packaging Campus in Peoria

Samsung Reboots Texas Chip Plant Investment, Seeks 2nm Clients in SF2P Push

Intel Amends CHIPS Deal, Issues Shares as U.S. Takes Near-10% Stake

Samsung Plans Up to $50 Billion U.S. Chip Investment to Secure Tariff Exemptions

Bitmain to Open U.S. ASIC Factory and New HQ in Texas or Florida