Technology ❯ Manufacturing Processes ❯ TSMC

2nm Process

N2P Technology Lithography

Leaked Schematic Suggests HPB Cooling as Qualcomm Reportedly Plans Two‑Tier Snapdragon 8 Elite Gen 6

Leakers depict a Pro variant offering LPDDR6 with UFS 5.0 alongside backward compatibility for cost control.

Leak Points to Qualcomm Testing 5GHz Cores, Exploring Samsung HPB Cooling for Snapdragon 8 Elite Gen 6