Overview
- Reports sourced to a Weibo tipster known as Fixed-focus digital cameras claim Snapdragon 8 Elite Gen 6 and Gen 6 Pro could adopt Samsung’s Heat Pass Block cooling.
- Neither Qualcomm nor Samsung has confirmed HPB use on Snapdragon chips, leaving the claims unverified for now.
- HPB relocates DRAM off the package and places a copper heatsink directly on the die, with early Exynos 2600 reporting citing about a 16% improvement in thermal resistance.
- Coverage ties the rumored shift to testing of performance cores around 5.00GHz and to the wider view that vapor chambers and graphite sheets are nearing practical limits in phones.
- SamMobile notes speculation about supply-chain routes and flags potential use in future Galaxy S27 models, though manufacturing and licensing choices remain unclear.