Overview
- Multiple outlets citing Weibo tipsters report Qualcomm is preparing SM8975 (Snapdragon 8 Elite Gen 6 Pro) and SM8950 (standard Gen 6) with distinct memory, cache, and GPU tiers.
- A newly shared schematic attributed to the same source shows Samsung’s Heat Pass Block heatsink on the Pro chip plus a package‑on‑package layout and UFS 5.0 using two lanes.
- Reports say the Pro supports LPDDR6 as well as LPDDR5X and LPDDR5, whereas the non‑Pro is described as limited to LPDDR5 or LPDDR5X depending on the source, with all details unconfirmed.
- Both chips are tipped for 2nm‑class fabrication such as TSMC N2P, a shift expected to raise silicon costs and steer brands to reserve the Pro for Ultra‑tier phones.
- Xiaomi is reportedly testing the SM8975, but tipsters warn LPDDR6 could cost about 20% more than LPDDR5X and initially come only in 16GB, making OEMs likely to choose cheaper memory options.