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HBM Development Automotive Lidar Solid-State Technology Fabrication Networks Satellite Connectivity Custom Memory Solutions NVMe 2.0 Chip Processes 14A Process GPU Development

Reports Point to Samsung’s Exynos 2700 Using Side-by-Side RAM for Cooler, Faster Memory

The shift would signal a rethink of phone chip layout to ease heat for higher efficiency.

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Japan Becomes Largest Shareholder in Rapidus With ¥100 Billion Injection as ¥267.6 Billion Round Closes

Samsung Sets 2026 Ramp for Second-Gen 2nm as Exynos 2700 Test Listing Emerges

Hesai Named Nvidia Hyperion Lidar Partner as It Ramps 2026 Output

Tory Bruno Named President of Blue Origin’s New National Security Group

TSMC to Build Three More 2nm Fabs in Taiwan to Boost 2026 Output

HWMonitor Update Confirms Intel Panther Lake Lineup as Early Benchmarks Point to Strong iGPU Gains

JEDEC Says UFS 5.0 Nearing Completion, Doubling Phone Storage Throughput for AI

QuantumScape Soars to 52-Week High on Corning Manufacturing Deal

Tesla Activates First Full V4 Supercharger Delivering 500 kW in California

Samsung Passes Nvidia's HBM3E Quality Test, Joining the Supply Chain

SK Hynix Solidifies AI Memory Lead with Custom HBM4 and 30% Growth Forecast

Intel Weighs Halting 18A Foundry Sales to Refocus on 14A Process

QuantumScape Integrates Cobra Process to Accelerate Solid-State Battery Output

Samsung Launches 9100 Pro SSD, the Fastest Consumer Drive Yet

Nvidia Accelerates SK Hynix Chip Timeline Amid AI Demand

TSMC to Install First High-NA EUV Lithography Machine This Month