Overview
- Multiple outlets report that Samsung is exploring a side-by-side layout for Exynos 2700 that places RAM next to the main processor, with fan-out wafer-level packaging used to enable the lateral placement.
- By shortening the path between the processor and memory, the design is estimated to raise memory bandwidth by about 30–40% while cutting the power needed to move data.
- Separating the hot components spreads heat across a larger area, and Samsung’s HPB cooling—first used with Exynos 2600—could pull more heat away for steadier performance.
- The chip is expected to target premium phones in 2027, with reports suggesting possible use in base and Plus Galaxy S27 models in select markets, though Samsung has not confirmed details.
- An early Geekbench entry tied to Exynos 2700 showed modest scores, and a social post comparing Exynos 2600 favorably with a recent Snapdragon points to thermal gains, but both data points remain preliminary.