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ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

A dual‑pulse, high‑rate tin‑droplet method now puts pressure on suppliers of optics, debris control, resists, pellicles.

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

EU Court Cuts Intel Antitrust Fine to €237 Million, Upholds 'Naked Restrictions' Finding

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

OpenAI’s 26-GW Chip Commitments Boost Supplier Outlook, Expose Financing and Power Hurdles

AMD’s Strong Quarter Collides With Split Street as HSBC Trims Target and AI Pricing Assumptions

Intel Nova Lake Enters Pre-QS With 28-Core Desktop Sample as Company Targets 2026 High-End Comeback

AMD Unveils Instinct MI350 and MI400 Series GPUs, Previews Open-Standard Helios Rack Server

Qualcomm Announces Return to Data Center Market with Arm-Based CPUs