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Intel Names Seok‑Hee Lee to Lead Standalone Advanced Packaging Unit

The move creates a separate advanced‑packaging business to scale EMIB‑T HBI technologies for AI‑focused high‑performance customers.

TSMC Stock Doubles as Company Pushes Capacity Buildout to Serve Surging AI Demand

SanDisk Hits All‑Time High on AI Storage Demand and Price‑Target Upgrades

Qualcomm in Talks to Buy Tenstorrent for $8–$10 Billion

AI Capital Spending Powers Columbia Threadneedle’s Q1 Tech Outperformance

Broadcom Beats Q2 but Guides Lower on AI Margins and Triggers Sharp Market Sell-Off

Marvell to Join S&P 500 After Clearing GAAP Profitability Test

Microsoft Shares Fall After Strong Quarter as Investors Question AI Infrastructure Payoff

Microchip Breaks Out Data‑Center Unit and Sees Rapid Growth as Shares Surge

SK Hynix Hits Roughly $1 Trillion Market Value

Mizuho Lifts Targets on Micron, SanDisk and Tech Peers Citing Surging AI Memory Demand

Cathie Wood Buys Cerebras Shares After IPO, Trims AMD Stake

Sequans Exits Bitcoin Treasury After Selling 456 BTC and Pledging to Liquidate Remaining Holdings

Micron’s AI-Driven Rally Strengthens as Virginia Plant Begins Advanced DRAM Production

Japan Seeks ¥10 Trillion in Private Investment as Delhi Proposes Dwarka as Tech Hub

TSMC Announces 14‑Reticle CoWoS Platform and Moves to Rebalance Holdings

Samsung Strike Threat Tightens Memory Market, Boosts Micron Forecasts

TCW Growth Fund Falls 11.75% in Q1, Adds McKesson and Palantir

Marvell Shares Set New High After AMD Discloses Stake and Wall Street Lifts Targets

Applied Materials Tops Q2 and Raises Guidance on AI Spending Surge