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Semiconductors

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4 ARTICLES

4d ago

Intel Names Seok‑Hee Lee to Lead Advanced Packaging for Its Foundry

The move creates a standalone packaging business intended to speed EMIB‑T and HBI to high-volume production and strengthen system integration for AI and high-performance computing.

3 ARTICLES

last wk.

OECD Finds Industry Subsidies at Post‑Crisis High and Shows Chinese Firms Receive Far Greater Support

9 ARTICLES

last mo.

Samsung Unions Keep Strike Plan as Company Seeks Unconditional Talks

5 ARTICLES

last mo.

Big Tech Offers to Fund SK Hynix Fabs and EUV Gear to Secure AI Memory

7 ARTICLES

last mo.

AI Data Centers Are Draining Memory Supply, Pushing Up Gadget Prices

5 ARTICLES

last mo.

TSMC Prioritizes Advanced Packaging and Pushes Back High‑NA EUV Rollout

11 ARTICLES

last mo.

Samsung Chip Union Sets 18-Day Strike, Threatening Memory Supply

3 ARTICLES

last mo.

Denso Weighs Pulling Rohm Bid as Three-Way Chip Tie-Up Advances

6 ARTICLES

2mo ago

Lam Research Beats Q3 and Raises Outlook as Analysts Lift Targets

9 ARTICLES

2mo ago

South Korea’s Economy Posts Fastest Quarterly Growth Since 2020 on Chip Export Boom

3 ARTICLES

2mo ago

Leaked Documents Reveal ASML’s Managerial Cuts and Summer Hiring Freeze

8 ARTICLES

2mo ago

Korean Unions Push Profit-Linked Bonuses as Samsung Strike Threat Looms

10 ARTICLES

2mo ago

TSMC Raises Guidance as AI Demand Spurs Bigger 3nm Spend

11 ARTICLES

2mo ago

India Breaks Ground on First 3D Glass Chip Packaging Plant in Odisha

3 ARTICLES

2mo ago

Japan Plans ¥60 Billion Subsidy for Sony’s Kumamoto Image-Sensor Plant

Semiconductors

Intel Names Seok‑Hee Lee to Lead Advanced Packaging for Its Foundry

Samsung Tops Global Chipmakers With Nearly 90 Trillion Won in 2025 Investment

TSMC Warns AI Chip Demand Will Outpace Supply for Years

Grimes County Approves 35-Year Tax Abatement for SpaceX’s Proposed Terafab

U.S. Trade Groups Press Government Over AI-Driven Memory Chip Shortage

Fire and Hydrogen Fluoride Leak Evacuate 3,600 at SK Hynix Cheongju Plant

OECD Finds Industry Subsidies at Post‑Crisis High and Shows Chinese Firms Receive Far Greater Support

Samsung Unions Keep Strike Plan as Company Seeks Unconditional Talks

Big Tech Offers to Fund SK Hynix Fabs and EUV Gear to Secure AI Memory

AI Data Centers Are Draining Memory Supply, Pushing Up Gadget Prices

Never miss stories about

Semiconductors

TSMC Prioritizes Advanced Packaging and Pushes Back High‑NA EUV Rollout

Samsung Chip Union Sets 18-Day Strike, Threatening Memory Supply

Denso Weighs Pulling Rohm Bid as Three-Way Chip Tie-Up Advances

Lam Research Beats Q3 and Raises Outlook as Analysts Lift Targets

South Korea’s Economy Posts Fastest Quarterly Growth Since 2020 on Chip Export Boom

Leaked Documents Reveal ASML’s Managerial Cuts and Summer Hiring Freeze

Korean Unions Push Profit-Linked Bonuses as Samsung Strike Threat Looms

TSMC Raises Guidance as AI Demand Spurs Bigger 3nm Spend

India Breaks Ground on First 3D Glass Chip Packaging Plant in Odisha

Japan Plans ¥60 Billion Subsidy for Sony’s Kumamoto Image-Sensor Plant

Never miss stories about

Semiconductors