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Anthropic Builds In‑House Chip Team to Optimize Claude

The company says co‑designing hardware and models will cut per‑token costs and speed inference for large enterprise workloads.

Samsung and Broadcom Sign $200 Billion MOU Tying HBM, 2nm Foundry and Packaging

ASML Near Record Valuations After Musk Is Confirmed to Speak at Company Conference

Alibaba Explores IPO for T-Head Chip Unit After Employee-Ownership Restructuring Plan