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AI Chips

Reports Say TSMC Has Validated an Angstrom‑Class 1.6nm (A16) Process

If confirmed, the design would be aimed at AI and high‑performance chips and would use backside power delivery to improve efficiency.

Baidu’s AI Cloud Surges as Q2 Revenue Falls

Nvidia’s AI Lead Persists as Markets Weigh Google TPUs and a Memory Squeeze

Goldman Backs Microsoft as Shares Slide on AI Spending Fears

Broadcom Ramps AI Infrastructure With 102.4 Tbps Switch Shipments as Bullish Targets Rise

Alphabet Taps 100-Year Bond as Big Tech’s AI Build-Out Swells to Roughly $670 Billion