Overview
- Xiaomi formally introduced the Xring O3 on Aug. 24 and says it has entered mass production with TSMC using a 3nm N3P process.
- The company confirmed the O3 will power the Xiaomi 18 Fold and Pad 9 Pro Max at a China launch in September and is targeting an initial shipment run of about 200,000 to 300,000 units.
- Xiaomi released technical and benchmark claims for the O3 — including an AnTuTu score above 5 million, LPDDR6 support, a 10-core all‑big‑core CPU, a 16‑core GPU and a 200 TOPS NPU — but those figures remain company data pending independent verification.
- Reports conflict over LPDDR6 memory sourcing, with Chinese supplier CXMT and South Korea’s SK hynix both cited in coverage and Xiaomi not publicly confirming final suppliers, a detail that could affect yields and pricing.
- Xiaomi also contracted TSMC to make two companion chips, the O100 AI accelerator and the D100 for driving applications, signaling a wider push to bring more AI and automotive workloads onto in‑house silicon and tighten supply‑chain control.