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Xiaomi Confirms 18 Fold and Shows XRing O3 Mid‑Fold at IFA

The preview signals Xiaomi’s push to run flagship AI tasks on its new in‑house XRing O3 chip.

Overview

  • Xiaomi confirmed the Xiaomi 18 Fold will launch on September 7 and publicly showcased a cherry‑red unit at IFA 2026 behind glass.
  • The phone uses a new short, wide “mid‑fold” shape with a 7.58‑inch inner display and a 5.38‑inch cover panel designed for one‑hand carry and large‑screen multitasking.
  • Xiaomi says the 18 Fold is its first flagship powered by the in‑house XRing O3 SoC and that the device was co‑engineered with Leica for a triple‑camera system.
  • Early benchmark traces and company claims include a Geekbench AI listing for an XRing O3 prototype and manufacturer‑published figures for LPDDR6 support, AnTuTu scores, battery size, and charging speeds, but those performance and supplier claims are not yet independently verified.
  • The move to ship a foldable with Xiaomi’s own high‑end chip aims to cut reliance on outside SoC vendors and could shift more AI work onto the device, a change that may affect component sourcing, yields, and pricing as final hardware reaches reviewers.