Overview
- The World Artificial Intelligence Conference, which opened Friday, July 17, produced a wave of coordinated product and infrastructure announcements that signal a shift from model capability work to real‑world deployment plans.
- Honor opened preorders for its Robot Phone and said it will ship the device in the third quarter while promoting Agentic OS, an evolution of MagicOS designed to let multimodal agent software control cameras, motion (a four‑degree‑of‑freedom mechanical gimbal) and cloud services on the phone.
- BrainCo publicly launched an integrated brain‑control research platform that combines EEG sensors, neural decoding and robot control in one graphical workflow and says researchers can get basic mind‑control tests running in about ten minutes.
- Chip and compute makers highlighted on‑device and datacenter power: Oriental Compute Chip showed the DF1000 near‑memory 3D AI chip claiming up to 520 TFLOPS at BF16, and China Telecom said its XiRang platform now manages more than 100 EFLOPS and that the company has built over 900 data centers with nearly 8 GW of power capacity.
- Speakers warned that engineering, terminal design and governance will determine whether these devices are safe and useful, and experts noted China’s national compute network has finished roughly 70% of its first‑stage resource aggregation with a fully seamless, user‑transparent fabric likely years to decades away.