Overview
- TSMC, presenting Thursday at its Taiwan technology symposium, said the global semiconductor market will top $1.5 trillion by 2030.
- It expects AI and high‑performance computing to account for about 55% of that total, with smartphones at 20% and automotive at 10%.
- The company plans nine new phases of wafer fabs and advanced packaging in 2026 to handle an elevenfold jump in AI accelerator wafer demand since 2022.
- It targets about 70% yearly growth in 2‑nanometer and A16 chip capacity from 2026 to 2028, with CoWoS packaging capacity rising at more than 80% a year through 2027.
- TSMC's global buildout is advancing as Arizona begins production with more fabs and land secured, Japan's first fab runs volume and a second shifts to 3nm, and Germany's plant proceeds under construction.