Overview
- TSMC said at the Taiwan Technology Symposium on May 14 that it plans to begin production in 2028 of a 14‑reticle chip‑on‑wafer‑on‑substrate (CoWoS) platform that can support up to 20 stacked high‑bandwidth memory (HBM) chips.
- Alongside the packaging announcement, TSMC unveiled new process names — A13, A12 and N2U — signaling continued node and process development to pair with advanced packaging.
- The company disclosed on May 15 plans for a block trade to sell up to 152 million Vanguard International Semiconductor (VIS) shares, trimming its stake to about 19% while saying VIS will remain a strategic partner for interposers and GaN licensing.
- TSMC and Sony signed a non‑binding memorandum of understanding on May 8 to explore a joint venture for next‑generation image sensors to use capacity in Sony’s new Koshi City fab.
- Analysts and investors responded positively to the announcements, with Bank of America reaffirming a Buy rating and market commentators citing strong revenue, record margins and high capex aimed at meeting surging AI and high‑performance computing demand.