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Top Memory Makers Sell Out DRAM and HBM Production for 2027

Long-term advance‑payment contracts by cloud and AI customers have secured capacity, leaving few chips for consumer devices.

Overview

  • Industry supply-chain reports on Wednesday said Samsung, SK hynix and Micron have allocated all of their DRAM and HBM production for 2027 to buyers under long-term deals.
  • High-bandwidth memory, which powers AI accelerators and large server models, and server DRAM were prioritized because cloud and hyperscaler buyers offered multi-year advance payments.
  • NAND flash for SSDs is tighter but not as locked down and is expected to be fully booked by the end of August 2026 according to the same supply-chain sources.
  • Manufacturers are reportedly assigning only about 60 to 70 percent of requested volumes to customers, prompting device makers to stockpile, strike long-term deals, or seek alternative suppliers including contested vendors.
  • Building new fabs and qualifying new process nodes takes years, so analysts and suppliers expect constrained DRAM and HBM availability and sustained price pressure through 2027 even if NAND eases later.