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TECNO Debuts Ultra-Thin Modular Phone Concept Ahead of MWC 2026

A 4.9mm base links to snap-on modules via magnets, pogo pins and wireless data, with no release yet confirmed.

Overview

  • TECNO’s concept centers on a 4.9mm base phone plus a 4.5mm power bank module that together reach a thickness comparable to typical flagships.
  • A hybrid system uses a precision magnetic array for attachment, pogo-pin connectors for power delivery, and wireless data that switches among Wi‑Fi, Bluetooth and mmWave.
  • The initial ecosystem spans about ten modules, including a slim power bank, an action camera, a telephoto lens that uses the phone’s screen as a viewfinder, and off-grid communication tools.
  • Two design interpretations—ATOM and MODA—are shown, with an eight-zone back layout guiding where modules align and attach.
  • TECNO will showcase the platform at MWC 2026 in Barcelona as a long-term design experiment, with journalists noting past modular efforts like Project Ara, LG G5 and Moto Mods and that commercial viability remains unproven.