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Tata Electronics Seals ASML MoU to Power India’s First 300mm Chip Fab in Gujarat

The pact secures access to critical chipmaking tools essential for India’s first commercial fab.

Overview

  • Tata Electronics and ASML signed a memorandum of understanding on Saturday in The Hague, with Prime Minister Narendra Modi and Dutch Prime Minister Rob Jetten witnessing the deal.
  • ASML will supply deep‑ultraviolet lithography equipment, training, and R&D support to help establish and ramp the Dholera plant, which uses light to etch circuits on silicon wafers.
  • The planned 300 mm fab targets process nodes around 28 to 110 nanometers, a reported capacity of about 50,000 wafers per month, and an investment near ₹91,000 crore, producing chips for cars, phones, and AI uses.
  • The project builds on Tata’s technology partnership with Taiwan’s PSMC, which covers mature nodes such as 28 nm, 40 nm, 55 nm, 90 nm, and 110 nm, and the company says construction is advancing.
  • India and the Netherlands elevated ties toward a strategic partnership during the visit, while industry analysts note the deal de‑risks lithography but leaves years of yield, supply‑chain, and talent work before dependable output.