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Tata Electronics, ROHM Seal India Chip Packaging Deal for Auto Power Devices

The pact moves India’s chip drive into execution by committing to automotive‑grade output with mass shipments targeted next year.

Overview

  • Tata Electronics will assemble and test ROHM’s India‑designed N‑channel 100V, 300A silicon MOSFET in a TOLL package for automotive applications.
  • The first product under the partnership is targeted for mass‑production shipments by next year, with both firms set to jointly market the devices.
  • The companies will explore co‑development of advanced, high‑value packaging technologies to deepen local manufacturing capabilities.
  • The collaboration aims to serve Indian and global customers while building a region‑based supply chain aligned with India’s Make in India goals.
  • The announcement follows Tata’s recent exploratory MoU with Intel and sits alongside Tata’s Gujarat fab and Assam OSAT build‑outs supported by government incentives and approvals.