Overview
- A broad specs dump from well-known tipsters on Monday detailed four Pixel 11 models ahead of an expected August 2026 launch, and none of it is confirmed by Google.
- The phones are tipped to run a new Tensor G6 built on a 2nm TSMC process with a PowerVR GPU, a Titan M3 security chip, and a MediaTek M90 5G modem replacing Samsung’s Exynos modems.
- Pro models and the Pro Fold are reported to drop the temperature sensor in favor of “Pixel Glow,” an RGB light array in the camera bar that can act as a notification light.
- Camera and memory changes include a new 50MP main sensor on the base Pixel 11 and new main and telephoto sensors on Pro models, with RAM tiers at 8GB/12GB for Pixel 11 and 12GB/16GB for Pro variants.
- The Pixel 11 Pro Fold is tipped to use a 6.3-inch outer OLED and a larger 2076×2160 inner display with slimmer bezels, while under-screen Face ID remains unverified and the IR “Project Toscana” face unlock is seen as unlikely this cycle.