Overview
- President Lee Jae Myung convened industry leaders as the government published a semiconductor strategy targeting the world’s largest production cluster and 10 new fabs through 2047.
- The plan commits 1.27 trillion won for AI-optimized chips, 215.9 billion won for next‑generation memory, and hundreds of billions more for compound semiconductors and advanced packaging.
- Officials are weighing a 4.5 trillion won, 12‑inch 40‑nanometre foundry funded by public and private capital to support domestic fabless firms’ development and testing of legacy‑node chips.
- The ecosystem push includes a cooperative foundry for local designers, a mass‑production test bed for materials, parts and equipment slated to be fully operational in 2027, and expanded semiconductor graduate programs by 2030 with designer training tied to Arm.
- A presidential semiconductor committee will coordinate policy, with signals of potential easing of separation‑of‑capital rules and considerations for localizing defense chips and priority purchasing provisions still pending formal approval.