Overview
- SK Group chairman Chey Tae-won publicly announced the plan at Computex in Taipei on Tuesday, saying SK Hynix will double wafer production capacity over the next five years to meet rising demand for high-bandwidth memory.
- Chey warned that a global wafer shortage could persist through 2030 and stressed that new memory fabs require heavy capital outlay and a multi-year build time before they add meaningful supply.
- He described deeper cooperation with Nvidia and TSMC as “greater than ever,” and confirmed joint work on the base die for next-generation HBM4 chips.
- SK Hynix is also advancing targeted investments, including its first advanced packaging plant under construction in the United States, while weighing customer proposals that would finance production and equipment.
- The push follows strong market momentum for memory makers, with SK Hynix topping $1 trillion in market value and holding about 58% of the HBM market in Q1, a shift that has lifted analysts’ profit forecasts for the sector.