Overview
- SK Hynix has received Intel EMIB substrates and started integration tests to link high‑bandwidth memory with logic chips, according to new reporting.
- EMIB uses tiny silicon bridges in the package substrate so side‑by‑side chiplets can talk at high speed, offering a different route than TSMC’s large silicon interposer used in CoWoS.
- Industry sources say the goal is to qualify an alternative to CoWoS as that service faces long‑running capacity limits that have slowed deliveries of HBM‑equipped accelerators.
- Analysts have cited EMIB validation yields up to about 90%, though reports caution that production yields and materials choices will decide whether the tech is ready for volume use.
- SK Hynix previously announced a $3.9 billion U.S. facility for 2.5D HBM packaging, and shares in both SK Hynix and Intel rose after the testing reports, which neither company has formally confirmed.