Overview
- The companies held an HBF Spec. Standardization Consortium kick-off at Sandisk’s Milpitas, California headquarters on Feb. 25 local time.
- A dedicated workstream under the Open Compute Project will begin developing industry specifications for High Bandwidth Flash.
- HBF is positioned between HBM and SSDs as a mid-tier memory layer designed to pair high bandwidth with large capacity for large-scale inference workloads.
- SK hynix and Sandisk plan to pursue both standardization and commercialization, leveraging SK hynix’s HBM expertise and Sandisk’s NAND and SSD capabilities.
- SK hynix cites forecasts that demand for complex memory solutions such as HBF could ramp toward 2030, and Sandisk shares rose about 3% in premarket trading following the announcement.