Overview
- The companies held an HBF Spec Standardization Consortium kick-off at Sandisk’s Milpitas, California headquarters on Feb. 25 local time.
- A dedicated Open Compute Project workstream will develop interoperable specifications to support multi-vendor adoption.
- HBF is presented as a layer between HBM and SSDs that bridges performance and capacity to improve scalability, power efficiency, and total cost of ownership for inference systems.
- SK hynix and Sandisk say they will pursue global standardization and commercialization by combining SK hynix’s HBM expertise with Sandisk’s NAND and flash capabilities.
- No detailed technical specifications or product timelines were disclosed, with industry forecasts suggesting broader demand growth for solutions like HBF near 2030.