Overview
- Samsung’s CTO said HBM4 enters mass production with shipments starting this month, citing “very satisfactory” customer feedback and positioning Nvidia as an expected early buyer.
- The new HBM4 parts target 11.7 Gbps data rates and are paired with a roadmap for HBM4E and HBM5 plus packaging advances such as Hybrid Copper Bonding and zHBM stacking.
- Acer confirmed it is qualifying smaller and new vendors, with reports indicating HP, Dell and Asus are testing Chinese supplier CXMT to secure DDR5 RAM as big three producers prioritize AI memory.
- Market trackers report steep hikes, with TrendForce expecting Q1 DRAM contract prices up roughly 90%–95% and NAND up 55%–60%, while spot DDR5 pricing has leapt multiplefold over the past year.
- Auto suppliers are warning of tightening allocations and higher costs, with Korea-based parts makers reporting a 52% rise in automotive memory prices and analysts cautioning production risks in the second half of 2026.