Overview
- Samsung disclosed in a regulatory filing that 2026 investment will exceed 110 trillion won, up 21.7% from last year and the first time its annual outlay tops 100 trillion won.
- The company says spending is centered on AI semiconductors, especially high-bandwidth memory, positioning its combined memory, foundry and advanced packaging operations as a one-stop offering.
- Manufacturing moves include efficiency upgrades at the P4 line, equipment installation for P5 with construction restarted and accelerated, new facilities in Yongin, and a Taylor, Texas foundry targeting operation by year-end.
- Samsung plans to pursue sizable M&A in areas such as robotics, medical technology, automotive electronics and HVAC, with substantial cash reserves reported at 126.9 trillion won that could finance deals beyond the capex plan.
- Industry coverage notes the push aims to narrow SK Hynix’s lead in HBM, and some analyses say Samsung’s 2026 chip spending would surpass TSMC’s outlay.