Overview
- Samsung’s System LSI president Park Yong-In confirmed on Thursday that the company is developing the Exynos 2700 and said work is proceeding without setbacks.
- Reports say Samsung plans to build the chip on its SF2P 2nm gate-all-around node and that the design may use a Heat Path Block, a Side-by-Side layout for dies, and fan-out wafer-level packaging to cut costs.
- Samsung’s 2nm process is estimated to be operating at roughly 60 percent yields, which reduces the number of usable chips per wafer, raises unit costs, and prevents taking orders from outside foundry customers.
- Analysts and reporting estimate Exynos presence in Galaxy S27 shipments could rise from about 25 percent this year to roughly 50 percent next year, a shift that would magnify waste if yields do not improve.
- Park says he is reviewing options to turn the business around, and the key near-term impacts to watch are phone availability, unit pricing, and whether yield gains allow broader Exynos routing instead of Qualcomm chips.