Overview
- Google has scheduled a Made by Google event for August 12 where the company is expected to confirm the Pixel 11 family and details about the next-generation Tensor G6 chipset; current coverage treats chip claims as unconfirmed leaks.
- Multiple leaks say the Pixel 11 series will debut a Tensor G6 reportedly built on TSMC’s advanced node, a move that outlets say should boost efficiency and on-device AI compared with prior Tensor chips.
- Reports from several tipsters claim Google is switching from Samsung Exynos modems to MediaTek’s M90 modem across the Pixel 11 lineup to address past problems with dropped signals and excess battery drain.
- Detailed leaks about a Pixel 11a (codename 'Formosan') allege it will use a lower-binned G6 variant, a 6.3-inch 60–120Hz AMOLED with very high reported brightness numbers, an advertised 'minimum' 4,870 mAh battery, Titan M3 security, and an updated front camera codenamed 'dokkaebi'; these claims remain unverified.
- If the leaks hold, the shift would mark a change in Google’s strategy for the affordable 'a' series by keeping newer processors while leaving final capacities, RAM tiers, exact pricing and ship dates to be confirmed after the August 12 announcement and later regulatory or retailer listings.