Overview
- After hosting a high-profile dinner with suppliers in Taipei, Jensen Huang told reporters TSMC must “work very hard” this year and said its capacity will likely need to more than double over the next decade.
- Huang warned that AI growth is now constrained by memory, saying “we need a lot of memory this year,” as Nvidia relies on SK Hynix, Samsung, and Micron for high‑bandwidth memory.
- TSMC has signaled up to $56 billion in 2026 capital spending with further increases in 2028–2029, and it is accelerating global fab and advanced packaging buildouts.
- Apple said its second‑quarter performance is limited by access to TSMC’s leading‑edge nodes and flagged higher memory costs, while TrendForce now expects DRAM contract prices to jump roughly 90–95% and NAND by 55–60% this quarter.
- The Wall Street Journal reports Apple is assessing alternate foundries for some lower‑end chips as Nvidia has reportedly become TSMC’s largest customer, reshaping capacity allocations.