Overview
- A deal announced Thursday between NVIDIA and Amkor commits a $1.5 billion prepayment under a multi-year partnership to fund Amkor’s advanced packaging and test expansion at its Arizona campus.
- The announcement sent Amkor shares sharply higher in after-hours trading, giving the company greater revenue visibility ahead of its Q2 2026 earnings report due Monday, July 27.
- The collaboration focuses on two specific packaging technologies—high-density interconnects, which speed data transfer inside packages, and heterogeneous integration, which combines different chips in one package—to meet growing needs of AI accelerators.
- Amkor stressed that facility buildout, process development and commercial scaling can take substantial time and warned timing, cost, specifications or expected benefits could change.
- The deal builds on Amkor’s June 2026 10-year agreement with TSMC to expand U.S. packaging capacity, signaling a broader industry push to add domestic advanced-packaging capacity and reduce reliance on Asia.