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NITI Aayog Roadmap Recommends India Shift From Cutting‑Edge Fabs to Advanced Packaging and Design

It urges a government anchor of about $45–60 billion to attract private capital, targeting a top‑three global role in advanced packaging by 2035.

Overview

  • The think tank published the 'Future of India’s Semiconductor Industry' roadmap on Friday and calls for a decisive pivot away from competing in the most advanced wafer nodes toward ecosystem roles that global firms cannot do without.
  • NITI Aayog quantifies a near‑term funding need of $135–180 billion over the next decade and proposes the government commit roughly one‑third—about $45–60 billion—as anchor capital to de‑risk projects and draw private investment.
  • The plan prioritises advanced packaging and OSAT (outsourced semiconductor assembly and test), mature‑node and compound‑semiconductor manufacturing, and chip design rather than chasing bleeding‑edge fabs.
  • The roadmap flags talent and materials as critical gaps and recommends a National Fab Academy, semiconductor curricula, technician training, and long‑term partnerships to secure inputs such as silicon carbide (SiC) and gallium nitride (GaN).
  • If executed, the strategy aims for a $120–150 billion domestic semiconductor value chain by 2035, 35–50% self‑sufficiency by 2030, and closer integration with trusted partners to reduce a current heavy import reliance that has cost India about $150 billion since FY2017.