Overview
- India Chip Pvt. Ltd., a 60:40 HCL–Foxconn joint venture, will build the packaging and test facility at YEIDA near Noida International Airport with about Rs 3,700 crore of investment.
- The plant is planned to process 20,000 wafers per month with a design output of roughly 36 million units monthly, focusing on display driver chips.
- Reported start dates differ, with several accounts expecting operations by 2028 and at least one report indicating 2027.
- Officials say the project will create about 3,500 direct and indirect jobs and support sectors including smartphones, laptops, tablets, automotive electronics and other consumer devices.
- Modi said 10 semiconductor projects have government approval and that four are set to begin production soon, positioning Uttar Pradesh as a growing electronics and semiconductor hub.