Overview
- Microsoft says Maia 200 delivers 10 PFlops of FP4 throughput with 216 GB of HBM3E, a 1.4 TB/s interconnect, and sub‑900‑watt power draw.
- Azure will offer Maia 200 instances first in the US Central region, followed by US West 3 in Phoenix.
- The company claims better performance per dollar than Google TPU v7 and AWS Trainium 3 by roughly 30 percent, with pricing not yet disclosed and independent benchmarks pending.
- Deployments can scale to as many as 6,144 interconnected nodes, and Microsoft’s Superintelligence Team is already using the chip for synthetic data generation and reinforcement learning.
- Maia 200 is built on TSMC’s N3P process, and a successor codenamed Clea (Maia 300) is planned for U.S. fabrication with Intel to strengthen supply security.