Overview
- Micron announced on July 9 that it will raise planned U.S. investment to more than $250 billion through 2035 and target about 40% of its DRAM output on U.S. soil to secure capacity for AI workloads.
- The company reported record fiscal Q3 results, with roughly $41.5 billion in revenue and extremely high margins, and disclosed 16 long‑term customer agreements worth about $22 billion that lock near‑term HBM and DRAM supply.
- Micron has started vertical construction at its Clay, New York megafab with a first concrete pour ahead of schedule and committed up to $3 billion to U.S. supply‑chain partners, including $500 million to GlobalWafers under a new 10‑year arrangement.
- Industry analysts warn that new fabs take three to four years before meaningfully adding output, HBM is essentially fully allocated through 2026, and peers Samsung and SK hynix are also accelerating builds so tightness may persist into 2027–2028.
- The urgency of the buildout is reshaping markets and politics: the investment will create tens of thousands of jobs in the U.S., has drawn praise from political leaders, and has prompted customer pressure, a putative class action and increased regulatory attention over pricing and allocations.