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Meta and Broadcom Extend AI Chip Pact Through 2029 With 1GW Launch

The agreement cements Meta’s plan to scale MTIA using Broadcom technology across chips, packaging, networking.

Overview

  • Meta and Broadcom, in a Tuesday announcement, expanded their partnership through 2029 to co‑develop MTIA chips with an opening commitment above 1 gigawatt.
  • Broadcom will provide its XPU custom accelerator platform plus Ethernet networking to design, build, and connect MTIA systems across Meta’s AI data centers.
  • Broadcom CEO Hock Tan will leave Meta’s board to serve as an advisor focused on Meta’s custom silicon roadmap.
  • The companies describe upcoming MTIA accelerators as 2‑nanometer class, with MTIA 300 already running Meta’s ranking and recommendation systems and more generations due by 2027.
  • Broadcom shares rose about 3 percent in after‑hours trading after the news, as hyperscalers push custom chips to cut dependence on general‑purpose GPUs.