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Memory Crunch Deepens as PC Makers Turn to China and Automakers Scramble for Chips

AI data centers are pulling wafer and packaging capacity into HBM, squeezing supply of conventional memory.

Overview

  • Lenovo is urging customers to buy now, warning that prices could jump again within six to 12 months and that availability is already slipping as partners sell out.
  • Major OEMs including HP, Dell, Acer and Asus are reported to be testing Chinese supplier CXMT and evaluating YMTC to backfill consumer DRAM, though qualification will take months and prices are unlikely to ease quickly.
  • Analysts expect first‑quarter contract prices to spike by about 90%–95% for DRAM and 55%–60% for NAND, while spot DRAM has surged several‑fold and retail RAM has climbed as much as 400% in some cases.
  • Auto‑parts executives are seeking allocations near Samsung and SK hynix plants in Korea as automotive memory costs rise more than 50% year over year, with inventories likely shielding output until mid‑2026 but disruption risk building in the second half.
  • Market winners are the memory makers: stocks have rallied and TrendForce projects a 2026 revenue surge of roughly 134%, reflecting AI’s heavy pull on HBM and constrained conventional supply.