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MediaTek Dimensity 8600 Tipped to Jump to 3nm as Chinese Brands Test Late‑2026 Phones

MediaTek has not confirmed the chip.

Overview

  • Leaks from tipster Digital Chat Station say the upper‑midrange Dimensity 8600 uses a 3nm process and a new architecture.
  • Oppo, Vivo, Xiaomi, Honor and their sub‑brands are reportedly testing phones with the chip, with launches expected toward the end of 2026.
  • Some prototypes are said to include batteries above 10,000mAh, signaling a push for much longer time between charges.
  • A shift to 3nm usually lowers power use and helps sustain performance under heavy loads versus the current 4nm Dimensity 8500.
  • Separately, reports point to a 2nm Dimensity 9600 flagship with first devices expected in September, showing a broader upgrade plan.