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Longsys Raises HK$7.08 Billion in Hong Kong Dual Listing as Shares Make Muted Debut

The company will use most of the proceeds to fund chip design and advanced memory research to compete for AI data‑centre and device demand.

Overview

  • Longsys completed its Hong Kong H‑share listing and began trading Tuesday after selling about 29.99 million H‑shares at HK$236 each, raising roughly HK$7.08 billion.
  • The Hong Kong debut was tepid with the stock trading marginally below the offer price, reflecting a wide discount to Longsys’ Shenzhen A‑share level and different investor pricing between the markets.
  • In its prospectus Longsys reported a sharp first‑half 2026 profit surge to RMB 10.7 billion from RMB 41 million a year earlier, which it attributed to higher selling prices caused by strong AI data‑centre demand and tight supply.
  • About 78% of net proceeds are earmarked for R&D in chip design and next‑generation memory products, and the deal included cornerstone investors such as Lenovo and Transsion with CITIC Securities and Citigroup as joint sponsors.
  • The listing is part of a broader 2026 wave of Chinese AI‑supply‑chain firms tapping Hong Kong to access international institutional capital and could speed Longsys’ move from module assembler toward in‑house chip capabilities.