Overview
- The leak of more than 630GB of engineering files from supplier Tata, first reported June 25, included board schematics and bills of materials for iPhone 18 Pro prototypes.
- Documents indicate two distinct iPhone 18 Pro logic boards: a U.S. part number that lists Qualcomm components tied to mmWave 5G and a non‑mmWave part that references Apple’s C2 modem.
- Multiple listings name Qualcomm parts such as the SDX80M and SDR875, which support mmWave bands that major U.S. carriers use for very high 5G speeds.
- The files also show internal hardware changes under test, including A20 Pro (Borneo) notes suggesting WMCM multi‑chip packaging and diagnostic IDs that point to a Sony IMX‑905 main sensor and possible variable aperture.
- Reporters and analysts stress the materials describe supplier‑stage prototypes so components, board designs and features including China eSIM changes may still change before final production.