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Intel Weighs Offering 18A to External Customers After Yield Gains

Intel expects advanced packaging contracts worth billions annually.

Overview

  • Intel CFO David Zinsner said CEO Lip-Bu Tan now views the 18A node as viable for external foundry customers, with specific inbound interest in the performance-enhanced 18A-P.
  • The company reports monthly yield improvements on 18A, though Reuters has noted that only a small share of output currently meets customer standards.
  • Intel continues to position 14A as its core external node, targeting risk production in 2027 and volume production by 2029 based on customer readiness.
  • Zinsner said advanced packaging using EMIB and Foveros is nearing multibillion-dollar, per‑year agreements, and the services can be used with silicon made outside Intel fabs.
  • Intel reaffirmed a goal to exit 2027 at break-even operating margins for its Foundry unit, and shares rose about 6% following the latest updates.