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Intel Ships First High-Volume Logic Wafers Made with ASML High NA EUV

Validation of ASML’s EXE scanners for production points to use on future nodes such as Intel 14A.

Overview

  • ASML said Wednesday that Intel Foundry is running select layers of its 18A Panther Lake process on ASML’s EXE:5200B High NA (0.55 NA) scanners and that wafers from those layers have entered the supply chain.
  • The patterned layers are dual-qualified so they can be exposed interchangeably on existing 0.33 NA NXE scanners or on the 0.55 NA EXE tools, and ASML reports EXE yields comparable to NXE yields.
  • Intel is applying High NA EUV only to a subset of tight-pitch, critical layers rather than replacing the full lithography flow, using a layer-by-layer approach to gather production data and preserve overall output.
  • Higher numerical aperture increases resolution in a single exposure, which reduces the need for complex multi-patterning and helps makers produce denser, higher-performance chip blocks used in AI and other workloads.
  • This deployment builds on ASML and Intel work that began with an EXE system install and acceptance testing at Intel’s Hillsboro, Oregon site in 2024 and positions High NA as a staged option for broader future adoption while other foundries plan later rollouts.