Overview
- Intel announced on Thursday that Seok‑Hee Lee will join as executive vice president of Intel Foundry reporting to CEO Lip‑Bu Tan.
- Lee will run advanced packaging, system integration, back-end technology development, and back-end manufacturing for the foundry business.
- Naga Chandrasekaran will remain responsible for front-end technology and manufacturing, including the ramp of Intel 18A and Intel 14A nodes.
- The company said it is establishing advanced packaging as a focused business to prepare EMIB‑T and HBI for high-volume production, which aim to combine multiple chips in a single package for better performance and power efficiency.
- Lee returns from SK On and previously led SK hynix, and Intel framed the hire as part of CEO Tan’s broader foundry overhaul that follows other senior hires and has supported renewed investor confidence.